New study has found that the properties of a material commonly used to create conductive or protective films and encapsulate drug compounds – and the conditions in which this material will disassemble to release that medication – may be different than initially thought.
from Engineering and Construction News – ScienceDaily https://www.sciencedaily.com/releases/2019/01/190107110833.htm
via Tumblr http://ndbasilica.tumblr.com/post/181809462824
No comments:
Post a Comment