Folding circuits just atoms thick using the principles of origami

While the creation of a paper swan using origami may be intriguing, the idea of creating 3-D circuits based on similar design principles is simply mindboggling. Researchers have focused on large scale synthesis and device fabrication using ultra-thin materials, which has led to improvements in 2-D models and the introduction of 3-D vertically integrated devices.

from Engineering and Construction News – ScienceDaily https://www.sciencedaily.com/releases/2017/11/171101130511.htm

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