Researchers have developed a technique to harvest 2-inch diameter wafers of 2-D material within just a few minutes. They can then be stacked together to form an electronic device within an hour.
from Engineering and Construction News – ScienceDaily https://www.sciencedaily.com/releases/2018/10/181012135312.htm
via Tumblr http://ndbasilica.tumblr.com/post/178985805619
No comments:
Post a Comment