Researchers have developed a new fabrication method that makes tiny, thin-film electronic circuits peelable from a surface. The technique not only eliminates several manufacturing steps and the associated costs, but also allows any object to sense its environment or be controlled through the application of a high-tech sticker.
from Engineering and Construction News – ScienceDaily https://www.sciencedaily.com/releases/2018/07/180716164508.htm
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