Nano-sandwiching improves heat transfer, prevents overheating in nanoelectronics

Sandwiching two-dimensional materials used in nanoelectronic devices between their three-dimensional silicon bases and an ultrathin layer of aluminum oxide can significantly reduce the risk of component failure due to overheating, according to a new study published in the journal of Advanced Materials led by researchers at the University of Illinois at Chicago College of Engineering.

from Engineering and Construction News – ScienceDaily https://www.sciencedaily.com/releases/2018/09/180912144414.htm

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