As transistor dimensions within integrated circuits continue to shrink, smooth metallic lines are required to interconnect these devices. If the surfaces of these tiny metal lines aren’t smooth enough, it substantially reduces their ability to conduct electrical and thermal energy – decreasing functionality. Engineers report an advance in modeling results that establish electrical surface treatment of conducting thin films as a physical processing method for reducing surface roughness.
from Engineering and Construction News – ScienceDaily https://www.sciencedaily.com/releases/2017/03/170307112822.htm
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